Invention Grant
- Patent Title: In-plane silicon heat spreader and method therefor
- Patent Title (中): 平面硅散热器及其方法
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Application No.: US13024994Application Date: 2011-02-10
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Publication No.: US08853007B2Publication Date: 2014-10-07
- Inventor: Kerry Bernstein , Sri M. Sri-Jayantha
- Applicant: Kerry Bernstein , Sri M. Sri-Jayantha
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Vazken Alexanian
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L23/373 ; H01L25/065 ; H01L23/367 ; H01L23/00
Abstract:
A method of dissipating heat from a heat source includes providing a plurality of heat flux paths in a plane of the heat source to remove heat from the heat source.
Public/Granted literature
- US20120031603A1 IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR Public/Granted day:2012-02-09
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