Invention Grant
- Patent Title: Repairing method, repairing device, and repairing structure for disconnected defect
- Patent Title (中): 修理方法,修理装置和拆卸缺陷的修理结构
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Application No.: US13811388Application Date: 2012-12-13
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Publication No.: US08853011B2Publication Date: 2014-10-07
- Inventor: Wen-da Cheng , Chujen Wu
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201210524347 20121207
- International Application: PCT/CN2012/086502 WO 20121213
- International Announcement: WO2014/086057 WO 20140612
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; G02F1/1362

Abstract:
A repairing method, repairing device and repairing structure for repairing a signal line of an array substrate having the disconnected defect, including: setting a repairing route according to a position of the disconnected defect and determining a position at which a filling portion is required to be formed according to the repairing route; forming the filling portion at the position at which the filling portion is required to be formed; and forming a repairing line along the repairing route. By detecting the repairing route before repairing the disconnected defect by forming the filling portion according to the repairing route, the present disclosure can avoid the disconnection of the repairing line caused by great height differences of the surface under the repairing line and improve the repairing success rate of the disconnected defect.
Public/Granted literature
- US20140162379A1 REPAIRING METHOD, REPAIRING DEVICE, AND REPAIRING STRUCTURE FOR DISCONNECTED DEFECT Public/Granted day:2014-06-12
Information query
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