Invention Grant
- Patent Title: Method of manufacturing semiconductor device having multi-channels
- Patent Title (中): 具有多通道的半导体器件的制造方法
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Application No.: US13722852Application Date: 2012-12-20
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Publication No.: US08853018B2Publication Date: 2014-10-07
- Inventor: Seung Joo Baek
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2012-0052244 20120517
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66

Abstract:
A method for manufacturing a semiconductor device having multi-channels is provided. The method includes etching an active region of a gate region and a device isolation layer of the gate to form a gate recess, forming a first gate buried in a lower portion of the gate recess, forming an active bridge on the first gate for connecting portions of the active region at both sides of the first gate, and forming a second gate on the first gate to cover the active bridge. Therefore, a multi-channel region can be formed.
Public/Granted literature
- US20130309825A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING MULTI-CHANNELS Public/Granted day:2013-11-21
Information query
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