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US08853018B2 Method of manufacturing semiconductor device having multi-channels 有权
具有多通道的半导体器件的制造方法

  • Patent Title: Method of manufacturing semiconductor device having multi-channels
  • Patent Title (中): 具有多通道的半导体器件的制造方法
  • Application No.: US13722852
    Application Date: 2012-12-20
  • Publication No.: US08853018B2
    Publication Date: 2014-10-07
  • Inventor: Seung Joo Baek
  • Applicant: SK hynix Inc.
  • Applicant Address: KR Icheon
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Icheon
  • Priority: KR10-2012-0052244 20120517
  • Main IPC: H01L21/336
  • IPC: H01L21/336 H01L29/66
Method of manufacturing semiconductor device having multi-channels
Abstract:
A method for manufacturing a semiconductor device having multi-channels is provided. The method includes etching an active region of a gate region and a device isolation layer of the gate to form a gate recess, forming a first gate buried in a lower portion of the gate recess, forming an active bridge on the first gate for connecting portions of the active region at both sides of the first gate, and forming a second gate on the first gate to cover the active bridge. Therefore, a multi-channel region can be formed.
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