Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13115648Application Date: 2011-05-25
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Publication No.: US08853020B2Publication Date: 2014-10-07
- Inventor: Mika Nishisaka
- Applicant: Mika Nishisaka
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.a.r.l.
- Current Assignee: PS4 Luxco S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-121640 20100527
- Main IPC: H01L21/336
- IPC: H01L21/336 ; B82Y40/00 ; B82Y10/00 ; H01L29/66 ; H01L21/265 ; H01L29/78

Abstract:
Extension regions 7 are formed through implantation using offset sidewalls 6a of a footing profile as a mask, and sidewalls 9 are formed on the offset sidewalls 6a so that source and drain regions 10 are formed into the sidewall through implantation, so that the extension regions 7 are made separated away from both edges of the gate, contributing to enlargement in an effective gate length, and dealing with the narrowed gate pitch, without increasing the number of processes.
Public/Granted literature
- US20110294270A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2011-12-01
Information query
IPC分类: