Invention Grant
US08853049B2 Single-sided non-noble metal electrode hybrid MIM stack for DRAM devices
有权
用于DRAM器件的单面非贵金属电极混合MIM堆叠
- Patent Title: Single-sided non-noble metal electrode hybrid MIM stack for DRAM devices
- Patent Title (中): 用于DRAM器件的单面非贵金属电极混合MIM堆叠
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Application No.: US13238349Application Date: 2011-09-21
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Publication No.: US08853049B2Publication Date: 2014-10-07
- Inventor: Wim Deweerd , Hanhong Chen , Hiroyuki Ode , Xiangxin Rui
- Applicant: Wim Deweerd , Hanhong Chen , Hiroyuki Ode , Xiangxin Rui
- Applicant Address: US CA San Jose JP Tokyo
- Assignee: Intermolecular, Inc.,Elpida Memory, Inc.
- Current Assignee: Intermolecular, Inc.,Elpida Memory, Inc.
- Current Assignee Address: US CA San Jose JP Tokyo
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L49/02 ; H01L27/108

Abstract:
A method for forming a DRAM MIM capacitor stack having low leakage current and low EOT involves the use of a first electrode that serves as a template for promoting the high k phase of a subsequently deposited first dielectric layer. The first high k dielectric layer comprises a doped material that can be crystallized after a subsequent annealing treatment. An amorphous, doped high k second dielectric material is form on the first dielectric layer. The dopant concentration and the thickness of the second dielectric layer are chosen such that the second dielectric layer remains amorphous after a subsequent annealing treatment. A second electrode layer compatible with the second dielectric layer is formed on the second dielectric layer.
Public/Granted literature
- US20130071989A1 SINGLE-SIDED NON-NOBLE METAL ELECTRODE HYBRID MIM STACK FOR DRAM DEVICES Public/Granted day:2013-03-21
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