Invention Grant
- Patent Title: Methods of forming capacitors
- Patent Title (中): 形成电容器的方法
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Application No.: US13615147Application Date: 2012-09-13
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Publication No.: US08853050B2Publication Date: 2014-10-07
- Inventor: Mark Kiehlbauch , Kevin R. Shea
- Applicant: Mark Kiehlbauch , Kevin R. Shea
- Applicant Address: US ID Boise
- Assignee: Micron Technology
- Current Assignee: Micron Technology
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L27/108 ; H01L49/02

Abstract:
Some embodiments include methods of making stud-type capacitors utilizing carbon-containing support material. Openings may be formed through the carbon-containing support material to electrical nodes, and subsequently conductive material may be grown within the openings. The carbon-containing support material may then be removed, and the conductive material utilized as stud-type storage nodes of stud-type capacitors. The stud-type capacitors may be incorporated into DRAM, and the DRAM may be utilized in electronic systems.
Public/Granted literature
- US20130005111A1 Methods of Forming Capacitors Public/Granted day:2013-01-03
Information query
IPC分类: