Invention Grant
- Patent Title: Particle reducing method
- Patent Title (中): 减粒法
-
Application No.: US13743508Application Date: 2013-01-17
-
Publication No.: US08853097B2Publication Date: 2014-10-07
- Inventor: Hitoshi Kato , Hiroyuki Kikuchi , Takeshi Kumagai
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2012-010162 20120120
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/44 ; C23C16/455
Abstract:
A particle reducing method includes a step of supplying a first gas to a vacuum chamber in which a susceptor, formed by an insulating object and the surface of which is provided with a substrate mounting portion, is rotatably provided; a step of generating plasma from the first gas by supplying high frequency waves to a plasma generating device provided for the vacuum chamber; and a step of exposing the substrate mounting portion, on which a substrate is not mounted, to the plasma while rotating the susceptor.
Public/Granted literature
- US20130189849A1 PARTICLE REDUCING METHOD AND FILM DEPOSITION METHOD Public/Granted day:2013-07-25
Information query
IPC分类:
