Invention Grant
- Patent Title: Resin bonded sorbent
- Patent Title (中): 树脂粘合吸附剂
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Application No.: US13032481Application Date: 2011-02-22
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Publication No.: US08853124B2Publication Date: 2014-10-07
- Inventor: Samuel A. Incorvia , Stanislav E. Solovyov , Thomas H. Powers , Michael W. Alabran
- Applicant: Samuel A. Incorvia , Stanislav E. Solovyov , Thomas H. Powers , Michael W. Alabran
- Applicant Address: US NY Buffalo
- Assignee: Multisorb Technologies, Inc.
- Current Assignee: Multisorb Technologies, Inc.
- Current Assignee Address: US NY Buffalo
- Agency: Simpson & Simpson, PLLC
- Main IPC: B01J20/26
- IPC: B01J20/26

Abstract:
A multi-functional resin bonded sorbent material including a blend of a resin, a sorbent and an electrically conductive material. The sorbent includes a plurality of sorbent particles uniformly dispersed within the resin so that each sorbent particle of the plurality of sorbent particles is fully surrounded by the resin and the electrically conductive material includes a plurality of conductive particles dispersed within the resin so that the plurality of conductive particles forms a conductive path.
Public/Granted literature
- US20110237422A1 RESIN BONDED SORBENT Public/Granted day:2011-09-29
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