Invention Grant
- Patent Title: Method and means for infiltrating enamel lesions
- Patent Title (中): 渗透釉质损伤的方法和手段
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Application No.: US12300437Application Date: 2007-05-11
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Publication No.: US08853297B2Publication Date: 2014-10-07
- Inventor: Hendrik Meyer-Lueckel , Sebastian Paris , Jan Mueller , Andrej M. Kielbassa , Bernd Detje
- Applicant: Hendrik Meyer-Lueckel , Sebastian Paris , Jan Mueller , Andrej M. Kielbassa , Bernd Detje
- Applicant Address: DE Berlin DE Hamburg
- Assignee: Charite Universitatsmedizin Berlin,Muhlbauer Technology GmbH
- Current Assignee: Charite Universitatsmedizin Berlin,Muhlbauer Technology GmbH
- Current Assignee Address: DE Berlin DE Hamburg
- Agency: Casimir Jones S.C.
- Priority: EP06021966 20061019
- International Application: PCT/EP2007/004204 WO 20070511
- International Announcement: WO2007/131725 WO 20071122
- Main IPC: A61K6/083
- IPC: A61K6/083 ; C08L33/00 ; C08L33/10 ; G01N11/02

Abstract:
The present invention refers to a method of infiltrating enamel for the prevention and/or treatment of carious lesions comprising (a) exposing an enamel area to a conditioner comprising hydrochloric acid; (b) exposing the conditioned enamel area to an infiltrant; and (c) curing the infiltrant. The present invention further refers to a kit for carrying out the method of infiltrating enamel, which comprises a conditioner comprising hydrochloric acid and an infiltrant comprising at least one low viscous dental resin. Alternatively, the kit comprises ready-to-use means for carrying out the method of infiltrating enamel, e.g. application strips with delivery pads soaked with conditioner or infiltrant. The present invention also refers to a method for identifying an infiltrant by calculation of the penetration coefficient, and to an infiltrant identified by the method having a penetration coefficient of >50 cm/s or comprising a low viscous light curing resin having a penetration coefficient of >50 cm/s.
Public/Granted literature
- US20090304622A1 METHOD AND MEANS FOR INFILTRATING ENAMEL LESIONS Public/Granted day:2009-12-10
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