Invention Grant
US08853544B2 Method of transferring thin film components and circuit board having the same
有权
传送薄膜部件的方法和具有该薄膜部件的电路板
- Patent Title: Method of transferring thin film components and circuit board having the same
- Patent Title (中): 传送薄膜部件的方法和具有该薄膜部件的电路板
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Application No.: US13416780Application Date: 2012-03-09
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Publication No.: US08853544B2Publication Date: 2014-10-07
- Inventor: Ryuichi Kondou , Kenichi Ota
- Applicant: Ryuichi Kondou , Kenichi Ota
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.
Public/Granted literature
- US20120228008A1 METHOD OF TRANSFERRING THIN FILM COMPONENTS AND CIRCUIT BOARD HAVING THE SAME Public/Granted day:2012-09-13
Information query
