Invention Grant
- Patent Title: Test card with a cuttable goldfinger structure
- Patent Title (中): 测试卡与可切割的金手指结构
-
Application No.: US13798040Application Date: 2013-03-12
-
Publication No.: US08853545B2Publication Date: 2014-10-07
- Inventor: Kuei-Yung Cheng , Yao-Quan Hu
- Applicant: Wistron Corporation
- Applicant Address: TW Hsinchu, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsinchu, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: CN201220586626 20121108
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H01R13/58 ; H05K1/14 ; H05K1/02

Abstract:
A test card includes a substrate and a goldfinger structure disposed on a side of the substrate. The goldfinger structure includes a first conductive section and a second conductive section. The first conductive section is inserted into a slot of a socket for electrically connecting to the socket. The second conductive section is connected to the first conductive section in a separable manner, and the second conductive section is inserted into the slot of the socket for electrically connecting to the socket after the first conductive section is cut for separating from the second conductive section.
Public/Granted literature
- US20140124240A1 TEST CARD WITH A CUTTABLE GOLDFINGER STRUCTURE Public/Granted day:2014-05-08
Information query