Invention Grant
- Patent Title: Flexible printed board
- Patent Title (中): 柔性印刷板
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Application No.: US13124699Application Date: 2009-10-09
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Publication No.: US08853547B2Publication Date: 2014-10-07
- Inventor: Andreas Voegerl , Tilo Liebl , Gerhard Bauer , Marion Gebhardt , Alexander Wenk , Matthias Wieczorek , Juergen Henniger , Karl-Heinz Baumann
- Applicant: Andreas Voegerl , Tilo Liebl , Gerhard Bauer , Marion Gebhardt , Alexander Wenk , Matthias Wieczorek , Juergen Henniger , Karl-Heinz Baumann
- Applicant Address: DE Nuernberg DE Weinheim
- Assignee: Conti Temic microelectronic GmbH,Carl Freudenberg KG
- Current Assignee: Conti Temic microelectronic GmbH,Carl Freudenberg KG
- Current Assignee Address: DE Nuernberg DE Weinheim
- Agent W. F. Fasse
- Priority: DE102008052244 20081018
- International Application: PCT/DE2009/001409 WO 20091009
- International Announcement: WO2010/043203 WO 20100422
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K3/00 ; H05K3/28
Abstract:
A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the carrier foil (1), and several soldering surfaces (2) arranged on a bonding side (12) of the carrier foil (1) opposite the solder side. The soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) is inseparably connected to the carrier foil (1) on the solder side thereof.
Public/Granted literature
- US20110232946A1 Flexible Printed Board Public/Granted day:2011-09-29
Information query
