Invention Grant
- Patent Title: Circuit board including mask for controlling flow of solder
- Patent Title (中): 电路板包括用于控制焊料流动的掩模
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Application No.: US13035127Application Date: 2011-02-25
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Publication No.: US08853550B2Publication Date: 2014-10-07
- Inventor: Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
- Applicant: Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Seema S. Katragadda
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/34 ; B23K35/30 ; B23K35/36 ; B23K35/38 ; B23K35/28 ; B23K35/32 ; B23K3/06 ; H05K3/24 ; H05K3/00
Abstract:
A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.
Public/Granted literature
- US20110139495A1 CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER Public/Granted day:2011-06-16
Information query
