Invention Grant
- Patent Title: Cold shrink assembly
- Patent Title (中): 冷缩组装
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Application No.: US13085691Application Date: 2011-04-13
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Publication No.: US08853563B2Publication Date: 2014-10-07
- Inventor: Dennis Verner , Stanley Szyszko
- Applicant: Dennis Verner , Stanley Szyszko
- Applicant Address: US DE Wilmington
- Assignee: Thomas & Betts International, LLC
- Current Assignee: Thomas & Betts International, LLC
- Current Assignee Address: US DE Wilmington
- Agency: Snyder, Clark, Lesch & Chung, LLP
- Main IPC: H01R4/70
- IPC: H01R4/70

Abstract:
A cold shrink assembly includes a first member, a second member and insulating material disposed over the first and second members. The first member may include first and second portions that are coupled together and configured to be separable from each other, where the first and second portions forming a main body having curved portions extending from the main body. The second member may include third and fourth portions that are coupled together and configured to be separable from each other, where the third and fourth portions form a receiving portion located at a second end of the second member. The receiving portion may be configured to secure the curved portions of the first member to the receiving portion when the first and second members are in a first position, and release the curved portions from the receiving portion when the first and second members are in a second position.
Public/Granted literature
- US20110254197A1 COLD SHRINK ASSEMBLY Public/Granted day:2011-10-20
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