Invention Grant
- Patent Title: Touch-sensing module
- Patent Title (中): 触摸感应模块
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Application No.: US13688178Application Date: 2012-11-28
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Publication No.: US08853569B2Publication Date: 2014-10-07
- Inventor: Yun-Nan Hsieh
- Applicant: E Ink Holdings Inc.
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW101105313A 20120217
- Main IPC: H01H13/70
- IPC: H01H13/70 ; H03K17/96 ; G06F3/044

Abstract:
A touch-sensing module including a plurality of first sensing strings and a plurality of second sensing strings is provided. Each of the first sensing strings includes a first strip-shaped conductive line and a plurality of first sensing pads connected to a same side of the first strip-shaped conductive line. Each of the second sensing strings includes a second strip-shaped conductive line and a plurality of second sensing pads connected to a same side of the second strip-shaped conductive line. The first strip-shaped conductive lines of the first sensing strings cross the second strip-shaped conductive lines of the second sensing strings. A crossing position of each of the first strip-shaped conductive lines and each of the second strip-shaped conductive lines forms an electrical reference node.
Public/Granted literature
- US20130213783A1 TOUCH-SENSING MODULE Public/Granted day:2013-08-22
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