Invention Grant
- Patent Title: Transistor and manufacturing method thereof
- Patent Title (中): 晶体管及其制造方法
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Application No.: US13830972Application Date: 2013-03-14
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Publication No.: US08853691B2Publication Date: 2014-10-07
- Inventor: Chih-Hsiang Yang , Ted-Hong Shinn , Wei-Tsung Chen , Hsing-Yi Wu
- Applicant: E Ink Holdings Inc.
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW101124055A 20120704
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/12 ; H01L27/14 ; H01L29/66 ; H01L21/00 ; H01L29/26 ; H01L29/786 ; H01L29/78

Abstract:
A transistor and a manufacturing method thereof are provided. The transistor includes a first gate, a second gate disposed on one side of the first gate, a first semiconductor layer, a second semiconductor layer, an oxide layer, a first insulation layer, a second insulation layer, a source, and a drain. The first semiconductor layer is disposed between the first and second gates; the second semiconductor layer is disposed between the first semiconductor layer and the second gate. The oxide layer is disposed between the first semiconductor layer and the second semiconductor layer. The first insulation layer is disposed between the first gate and the first semiconductor layer; the second insulation layer is disposed between the second gate and the second semiconductor layer. The source and the drain are disposed between the first insulation layer and the second insulation layer and respectively disposed on opposite sides of the oxide layer.
Public/Granted literature
- US20140008646A1 TRANSISTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-01-09
Information query
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