Invention Grant
- Patent Title: Test structure and method for bond pad quality monitoring
- Patent Title (中): 焊盘质量监测的测试结构和方法
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Application No.: US12625969Application Date: 2009-11-25
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Publication No.: US08853692B1Publication Date: 2014-10-07
- Inventor: Chin Boon Cheah , Boon Leng Lim
- Applicant: Chin Boon Cheah , Boon Leng Lim
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble, Carlyle, Sandridge & Rice
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A test structure for measuring bond pad quality is presented. The test structure includes a metal element that is defined over a dielectric layer. The metal element is then covered by a passivation layer, which has a number of probe points that exposes the top surface of the metal element. In addition, the top surface of the metal element is exposed between a pair of adjacent probe points.
Information query
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