Invention Grant
- Patent Title: Light emitting device, manufacturing method thereof, and optical device
- Patent Title (中): 发光元件及其制造方法以及光学元件
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Application No.: US13300002Application Date: 2011-11-18
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Publication No.: US08853725B2Publication Date: 2014-10-07
- Inventor: Yuki Tanuma
- Applicant: Yuki Tanuma
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2010-258531 20101119
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.
Public/Granted literature
- US20120126269A1 LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OPTICAL DEVICE Public/Granted day:2012-05-24
Information query
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