Invention Grant
- Patent Title: Light emitting diode cable and heat sink
- Patent Title (中): 发光二极管电缆和散热片
-
Application No.: US13711073Application Date: 2012-12-11
-
Publication No.: US08853727B1Publication Date: 2014-10-07
- Inventor: David Sanso , Mason Williams , Brent Hymel , Aaron Pitzer
- Applicant: David Sanso , Mason Williams , Brent Hymel , Aaron Pitzer
- Agent Luis Figarella
- Main IPC: H01L29/22
- IPC: H01L29/22
Abstract:
A high output light emitting diode (LED) based lighting module includes a plurality of LEDs on a substrate board, a fiber optic mounting assembly that securely holds a plurality of fiber bundles that form a fiber cable to said LEDs so that each LED mates to a fiber bundle making each fiber bundle slightly overlap the active area of its respective LED and mechanical means for holding each fiber optic bundle a fixed distance from said LED substrate.
Information query
IPC分类:
