Invention Grant
- Patent Title: LED mounting substrate and method of manufacturing the same
- Patent Title (中): LED安装基板及其制造方法
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Application No.: US13919874Application Date: 2013-06-17
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Publication No.: US08853728B2Publication Date: 2014-10-07
- Inventor: Yosuke Tsuchiya , Shota Shimonishi , Hiroyuki Tajima , Akira Sengoku
- Applicant: Toyoda Gosei Co., Ltd.
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-154827 20120710
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H05K1/02
Abstract:
An LED mounting substrate includes a base substrate, a conductive pattern formed on the base substrate and including a recessed portion on an upper surface thereof, and a light reflecting film formed in an inter-pattern gap of the conductive pattern on the base substrate and in the recessed portion of the conductive pattern.
Public/Granted literature
- US20140014992A1 LED MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-01-16
Information query
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