Invention Grant
- Patent Title: Light emitting device and manufacturing method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US11849097Application Date: 2007-08-31
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Publication No.: US08853730B2Publication Date: 2014-10-07
- Inventor: Bo Geun Park
- Applicant: Bo Geun Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2006-0084901 20060904
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54

Abstract:
A light emitting device comprises a substrate including a top surface that is flat, a light emitting diode on the substrate, a lead frame formed on the flat top surface of the substrate. The lead frame includes a circuit with a predetermined pattern to electrically connect to the light emitting diode. A dam part is formed on the substrate and is adjacent to the light emitting diode. A first member is formed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode. A second member is surrounded by the dam part and is formed on the substrate adjacent to the first member, and a lens covers the first member, the second member and the light emitting diode.
Public/Granted literature
- US20080054285A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-03-06
Information query
IPC分类: