Invention Grant
- Patent Title: Semiconductor light emitting device including bonding layer and semiconductor light emitting device package
- Patent Title (中): 半导体发光器件包括接合层和半导体发光器件封装
-
Application No.: US13419120Application Date: 2012-03-13
-
Publication No.: US08853731B2Publication Date: 2014-10-07
- Inventor: Sang Youl Lee , Jun Ho Song
- Applicant: Sang Youl Lee , Jun Ho Song
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0010703 20090210
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device including a bonding layer; a barrier layer on the bonding layer; an adhesion layer on the barrier layer, in which the adhesion layer includes Pd, Au, and Sn; a reflective layer on the adhesion layer, in which the reflective layer includes Ag; an ohmic contact layer on the reflective layer, in which the ohmic contact layer includes Pt and Ag; a light emitting structure layer on the ohmic contact layer; and a passivation layer includes an insulating material on a side surface and a top surface of the light emitting structure layer.
Public/Granted literature
- US20120168805A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2012-07-05
Information query
IPC分类: