Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13493745Application Date: 2012-06-11
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Publication No.: US08853737B2Publication Date: 2014-10-07
- Inventor: Shigeru Kusunoki
- Applicant: Shigeru Kusunoki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Company
- Current Assignee: Mitsubishi Electric Company
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2008-291327 20081113
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L27/088 ; H01L29/78 ; H01L29/40 ; H01L49/02 ; H01L29/06 ; H01L27/092 ; H01L21/8238 ; H03K17/08

Abstract:
A semiconductor device includes a semiconductor substrate including a semiconductor layer, a power device formed in the semiconductor substrate, a plurality of concentric guard rings formed in the semiconductor substrate and surrounding the power device, and voltage applying means for applying successively higher voltages respectively to the plurality of concentric guard rings, with the outermost concentric guard ring having the highest voltage applied thereto.
Public/Granted literature
- US20120248499A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-10-04
Information query
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