Invention Grant
- Patent Title: FinFET with enhanced embedded stressor
- Patent Title (中): FinFET具有增强的嵌入式压力
-
Application No.: US13457529Application Date: 2012-04-27
-
Publication No.: US08853750B2Publication Date: 2014-10-07
- Inventor: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- Applicant: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph Petrokaitis
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A channel region of a finFET has fins having apexes in a first direction parallel to a surface of a substrate, each fin extending downwardly from the apex, with a gate overlying the apexes and between adjacent fins. A semiconductor stressor region extends in at least the first direction away from the fins to apply a stress to the channel region. Source and drain regions of the finFET can be separated from one another by the channel region, with the source and/or drain at least partly in the semiconductor stressor region. The stressor region includes a first semiconductor region and a second semiconductor region overlying and extending from the first semiconductor region. The second semiconductor region can be more heavily doped than the first semiconductor region, and the first and second semiconductor regions can have opposite conductivity types where at least a portion of the second semiconductor region meets the first semiconductor region.
Public/Granted literature
- US20130285152A1 FINFET WITH ENHANCED EMBEDDED STRESSOR Public/Granted day:2013-10-31
Information query
IPC分类: