Invention Grant
US08853751B2 Reducing the inversion oxide thickness of a high-K stack fabricated on high mobility semiconductor material
有权
降低在高迁移率半导体材料上制造的高K叠层的反型氧化物厚度
- Patent Title: Reducing the inversion oxide thickness of a high-K stack fabricated on high mobility semiconductor material
- Patent Title (中): 降低在高迁移率半导体材料上制造的高K叠层的反型氧化物厚度
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Application No.: US13614962Application Date: 2012-09-13
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Publication No.: US08853751B2Publication Date: 2014-10-07
- Inventor: Takashi Ando , Martin M. Frank , Vijay Narayanan
- Applicant: Takashi Ando , Martin M. Frank , Vijay Narayanan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Jon A. Gibbons
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L29/78 ; H01L21/8234

Abstract:
A semiconductor structure includes a high mobility semiconductor, an interfacial oxide layer, a high dielectric constant (high-k) layer, a stack, a gate electrode, and a gate dielectric. The stack comprises a lower metal layer, a scavenging metal layer comprising a scavenging metal, and an upper metal layer formed on the scavenging metal layer. A Gibbs free energy change of a chemical reaction, in which an atom constituting the high mobility semiconductor layer that directly contacts the interfacial oxide layer combines with a metal oxide material comprising the scavenging metal and oxygen to form the scavenging metal in elemental form and oxide of the atom constituting the high mobility semiconductor layer that directly contacts the interfacial oxide layer, is positive.
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