Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus
- Patent Title (中): 固态成像装置，制造固态成像装置的方法和电子装置
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Application No.: US13412748Application Date: 2012-03-06
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Publication No.: US08853758B2Publication Date: 2014-10-07
- Inventor: Yoichi Ootsuka
- Applicant: Yoichi Ootsuka
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2011-055630 20110314
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L27/146
Abstract:
There is provided a solid-state imaging device including plural pixel regions, each including a pixel having a photoelectric conversion unit, a color filter, and a microlens that condenses the incident light to the photoelectric conversion unit; a first light shielding portion that has a first end face at the side of the microlens, and a second end face opposite to the first end face, and that is formed at each side portion of each pixel region of the plurality of the pixel regions; and a second light shielding portion that has a first end face at the side of the microlens, and a second end face opposite to the first end face, and that is formed at each corner portion of the pixel region, in which a distance from a surface of the pixel to the first end face is short compared to the first light shielding portion.
Public/Granted literature
- US20120235266A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2012-09-20
Information query
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