Invention Grant
US08853792B2 Transistors and semiconductor devices with oxygen-diffusion barrier layers
有权
具有氧扩散阻挡层的晶体管和半导体器件
- Patent Title: Transistors and semiconductor devices with oxygen-diffusion barrier layers
- Patent Title (中): 具有氧扩散阻挡层的晶体管和半导体器件
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Application No.: US13344431Application Date: 2012-01-05
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Publication No.: US08853792B2Publication Date: 2014-10-07
- Inventor: Murshed M. Chowdhury , James K. Schaeffer
- Applicant: Murshed M. Chowdhury , James K. Schaeffer
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/8238 ; H01L29/51 ; H01L29/49 ; H01L27/092 ; H01L21/8234 ; H01L29/78

Abstract:
Embodiments of transistors comprise a gate stack overlying a semiconductor material. The gate stack comprises a deposited oxide layer overlying the semiconductor material, an oxygen-diffusion barrier layer overlying the deposited oxide layer, a high-k dielectric layer overlying the oxygen-diffusion barrier layer, and a conductive material (e.g., an oxygen-gettering conductive material) overlying the high-k dielectric layer. When the conductive material is an oxygen-gettering conductive material, the oxygen-diffusion barrier layer prevents diffusion of oxygen from the deposited oxide layer to the oxygen-gettering conductive material.
Public/Granted literature
- US20120104515A1 TRANSISTORS AND SEMICONDUCTOR DEVICES WITH OXYGEN-DIFFUSION BARRIER LAYERS Public/Granted day:2012-05-03
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