Invention Grant
- Patent Title: ESD protection apparatus
- Patent Title (中): ESD保护装置
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Application No.: US13246672Application Date: 2011-09-27
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Publication No.: US08853825B2Publication Date: 2014-10-07
- Inventor: Jam-Wem Lee , Yi-Feng Chang
- Applicant: Jam-Wem Lee , Yi-Feng Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L29/732 ; H01L27/02 ; H01L29/06

Abstract:
An ESD protection apparatus comprises a substrate, a low voltage p-type well and a low voltage n-type well formed on the substrate. The ESD protection device further comprises a first P+ region formed on the low voltage p-type well and a second P+ region formed on the low voltage n-type well. The first P+ region and the second P+ region are separated by a first isolation region. The breakdown voltage of the ESD protection apparatus is tunable by adjusting the length of the first isolation region.
Public/Granted literature
- US20130075863A1 ESD Protection Apparatus Public/Granted day:2013-03-28
Information query
IPC分类: