Invention Grant
- Patent Title: Integrated circuit package and method of making the same
- Patent Title (中): 集成电路封装及其制作方法
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Application No.: US13662702Application Date: 2012-10-29
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Publication No.: US08853836B1Publication Date: 2014-10-07
- Inventor: Thomas P. Glenn
- Applicant: Amkor Technology, Inc.
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/62
- IPC: H01L23/62
Abstract:
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wares, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.
Information query
IPC分类:
