Invention Grant
- Patent Title: Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
- Patent Title (中): 引线框架，其包括具有由盖部分覆盖的通孔的端子部分，半导体封装及其制造方法
-
Application No.: US13855840Application Date: 2013-04-03
-
Publication No.: US08853841B2Publication Date: 2014-10-07
- Inventor: Yukiharu Takeuchi
- Applicant: Shinko Electric Industries Co., Ltd.
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2012-097053 20120420
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/544 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/48 ; H01L23/34 ; H01L23/00
Abstract:
A semiconductor package includes a lead frame including a chip mounting portion and a terminal portion, a semiconductor chip, which is mounted on the chip mounting portion and connected to the terminal portion, a through groove penetrating the terminal portion from one surface on a side of the semiconductor chip to another surface in a thickness direction of the terminal portion, a lid portion covering an end portion of the through groove on the side of the semiconductor chip, and a resin portion sealing the semiconductor chip, wherein the another surface of the terminal portion and a side surface of the terminal portion facing an outside of the semiconductor package are coated by a plating film.
Public/Granted literature
- US20130277817A1 LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-10-24
Information query
IPC分类:
