Invention Grant
- Patent Title: Package arrangement and a method of manufacturing a package arrangement
- Patent Title (中): 包装布置和制造包装布置的方法
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Application No.: US13786525Application Date: 2013-03-06
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Publication No.: US08853849B2Publication Date: 2014-10-07
- Inventor: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L49/02
Abstract:
In various embodiments, a package arrangement is provided. The package arrangement may include a first package. The package arrangement may further include a through hole package including at least one contact terminal. The first package may include at least one hole in an encapsulant to receive the at least one contact terminal of the through hole package. The received at least one contact terminal may provide a solder contact.
Public/Granted literature
- US20140252537A1 PACKAGE ARRANGEMENT AND A METHOD OF MANUFACTURING A PACKAGE ARRANGEMENT Public/Granted day:2014-09-11
Information query
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