Invention Grant
US08853863B2 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
有权
具有管芯堆叠布置的半导体器件包括交错管芯和有效的引线接合
- Patent Title: Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
- Patent Title (中): 具有管芯堆叠布置的半导体器件包括交错管芯和有效的引线接合
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Application No.: US13829739Application Date: 2013-03-14
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Publication No.: US08853863B2Publication Date: 2014-10-07
- Inventor: Chin-Chin Liao , Cheeman Yu , Ya Huei Lee
- Applicant: SanDisk Technologies Inc.
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L25/065 ; H01L23/00
Abstract:
A semiconductor die package is disclosed. An example of the semiconductor package includes a first group of semiconductor die interspersed with a second group of semiconductor die. The die from the first and second groups are offset from each other along a first axis and staggered with respect to each other along a second axis orthogonal to the first axis. A second example of the semiconductor package includes an irregular shaped edge and a wire bond to the substrate from a semiconductor die above the lowermost semiconductor die in the package.
Public/Granted literature
- US20130207280A1 SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED DIE AND EFFICIENT WIRE BONDING Public/Granted day:2013-08-15
Information query
IPC分类:
