Invention Grant
- Patent Title: Light emitting device, and method for manufacturing circuit board
- Patent Title (中): 发光元件及制造电路板的方法
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Application No.: US13291841Application Date: 2011-11-08
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Publication No.: US08853933B2Publication Date: 2014-10-07
- Inventor: Ryohei Yamashita , Tomohide Miki , Hiroto Tamaki
- Applicant: Ryohei Yamashita , Tomohide Miki , Hiroto Tamaki
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2010-253321 20101111
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62

Abstract:
A light emitting device comprises a light emitting element and a package constituted by a molded article and a first lead and a second lead embedded in the molded article, and having a bottom face, a top face disposed opposite to the bottom face, and a light emission face connected to the bottom face and the top face. The first lead has a first terminal part exposed at the bottom face exposed at the top face. The exposed part is provided more toward the center of the package than the first terminal part.
Public/Granted literature
- US20120120671A1 LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD Public/Granted day:2012-05-17
Information query
IPC分类: