Invention Grant
US08854052B2 Sensor assembly and method of measuring the proximity of a machine component to a sensor
有权
传感器组件和测量机器部件与传感器的接近度的方法
- Patent Title: Sensor assembly and method of measuring the proximity of a machine component to a sensor
- Patent Title (中): 传感器组件和测量机器部件与传感器的接近度的方法
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Application No.: US12951447Application Date: 2010-11-22
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Publication No.: US08854052B2Publication Date: 2014-10-07
- Inventor: Boris Leonid Sheikman , Steven Go
- Applicant: Boris Leonid Sheikman , Steven Go
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Fletcher Yoder P.C.
- Main IPC: G01R27/04
- IPC: G01R27/04 ; G01B7/02 ; G01B15/00
Abstract:
A microwave sensor assembly includes a signal processing device for generating at least one microwave signal that includes a pattern of frequencies and at least one probe coupled to the signal processing device. The probe includes an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device.
Public/Granted literature
- US20120126826A1 Sensor Assembly And Method Of Measuring The Proximity Of A Machine Component To A Sensor Public/Granted day:2012-05-24
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