Invention Grant
- Patent Title: Multi-chip system and semiconductor package
- Patent Title (中): 多芯片系统和半导体封装
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Application No.: US13841114Application Date: 2013-03-15
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Publication No.: US08854088B2Publication Date: 2014-10-07
- Inventor: Chun-Seok Jeong
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2012-0132958 20121122
- Main IPC: H03B1/00
- IPC: H03B1/00 ; H03K3/00 ; H03K3/36
Abstract:
A multi-chip system may include a plurality of chips, and a channel shared by the plurality of chips. At least one of the plurality of chips includes a transmission circuit configured to transmit a signal to the channel. Drivability of the transmission circuit is adjusted based on a number of the plurality of chips.
Public/Granted literature
- US20140139269A1 MULTI-CHIP SYSTEM AND SEMICONDUCTOR PACKAGE Public/Granted day:2014-05-22
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