Invention Grant
US08854141B2 RF amplifier module, integrated circuit device, wireless communication unit and method therefor
有权
RF放大器模块,集成电路器件,无线通信单元及其方法
- Patent Title: RF amplifier module, integrated circuit device, wireless communication unit and method therefor
- Patent Title (中): RF放大器模块,集成电路器件,无线通信单元及其方法
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Application No.: US13540619Application Date: 2012-07-03
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Publication No.: US08854141B2Publication Date: 2014-10-07
- Inventor: Hongli Zhang , Bernard Mark Tenbroek
- Applicant: Hongli Zhang , Bernard Mark Tenbroek
- Applicant Address: SG Singapore
- Assignee: MediaTek Singapore Pte. Ltd.
- Current Assignee: MediaTek Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Winston Hsu; Scott Margo
- Main IPC: H03F1/22
- IPC: H03F1/22 ; H03F3/72 ; H03F1/02 ; H03F3/193

Abstract:
A radio frequency (RF) amplifier module has a digitally controllable amplifier to receive a first biased signal, a further biased signal, and a digital control signal including a less significant bit (LSB) component and a more significant bit (MSB) component. The digitally controllable amplifier has an LSB module operating according to the first biased signal and the LSB component, and an MSB module operating according to the further biased signal and the MSB component. The RF amplifier module further has a biasing component to apply a first, operating DC bias voltage to the further biased signal when the digitally controllable amplifier operates in a higher gain mode and the MSB module outputs a load current component, and apply a second, higher DC bias voltage to the further biasing signal when the digitally controllable amplifier operates in a lower gain mode and the MSB module outputs the load current component.
Public/Granted literature
- US20130009710A1 RF AMPLIFIER MODULE, INTEGRATED CIRCUIT DEVICE, WIRELESS COMMUNICATION UNIT AND METHOD THEREFOR Public/Granted day:2013-01-10
Information query
IPC分类: