Invention Grant
- Patent Title: Chip resistor device and method for fabricating the same
- Patent Title (中): 贴片电阻器及其制造方法
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Application No.: US13790064Application Date: 2013-03-08
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Publication No.: US08854175B2Publication Date: 2014-10-07
- Inventor: Wan-Ping Wang
- Applicant: Ralec Electronic Corporation
- Applicant Address: TW Kaohsiung
- Assignee: Ralec Electronic Corporation
- Current Assignee: Ralec Electronic Corporation
- Current Assignee Address: TW Kaohsiung
- Agency: SmithAmundsen LLC
- Agent Kelly J. Smith; Dennis S. Schell
- Priority: TW101130806A 20120824
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C17/28 ; H01C13/02 ; H01C1/142 ; H01C17/00

Abstract:
A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.
Public/Granted literature
- US20140055228A1 CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-02-27
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