Invention Grant
- Patent Title: Decompression circuit and associated compression method and decompression method
- Patent Title (中): 减压电路及相关压缩方法及减压方法
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Application No.: US14018539Application Date: 2013-09-05
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Publication No.: US08854235B1Publication Date: 2014-10-07
- Inventor: Yu-Hsiang Tseng , Chih-Hao Chang , Cheng-Yu Hsieh
- Applicant: MStar Semiconductor, Inc.
- Applicant Address: TW Hsinchu Hsien
- Assignee: MStar Semiconductor, Inc.
- Current Assignee: MStar Semiconductor, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW102111971A 20130402
- Main IPC: H03M7/30
- IPC: H03M7/30 ; H03M7/40

Abstract:
A decompression circuit for decompressing data includes a first decompression unit and a second decompression unit. The data sequentially includes a compressed first string, a compressed distance-length pair and a compressed second string. The first decompression unit performs a first decompression on the data to obtain a first string, a distance-length pair and a second string. The second decompression unit receives and decompresses the first string, the distance-length pair and the second string. The first decompression unit does not involve data associated with the distance-length pair when decompression the second string.
Public/Granted literature
- US20140292547A1 DECOMPRESSION CIRCUIT AND ASSOCIATED COMPRESSION METHOD AND DECOMPRESSION METHOD Public/Granted day:2014-10-02
Information query
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