Invention Grant
US08854449B2 Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
有权
基板位置检测装置，具备该基板位置检测装置的成膜装置以及基板位置检测方法
- Patent Title: Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
- Patent Title (中): 基板位置检测装置，具备该基板位置检测装置的成膜装置以及基板位置检测方法
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Application No.: US13236700Application Date: 2011-09-20
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Publication No.: US08854449B2Publication Date: 2014-10-07
- Inventor: Katsuyoshi Aikawa , Manabu Honma
- Applicant: Katsuyoshi Aikawa , Manabu Honma
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2010-217253 20100928; JP2011-151081 20110707
- Main IPC: H01L21/66
- IPC: H01L21/66 ; C23C16/44 ; H01L21/687 ; C23C16/52 ; C23C16/455 ; H01L21/67 ; H01L21/68
Abstract:
A substrate position detection method includes rotating the susceptor so that the substrate receiving portion is moved into an image taking area of a imaging apparatus; detecting first two position detection marks provided in the process chamber so that the first two position detection marks are within the image taking area, wherein a first perpendicular bisector of the first two position detection marks passes through a rotational center of the susceptor; detecting second two position detection marks provided in the susceptor so that the second two position detection marks can be within the image taking area, wherein a second perpendicular bisector of the second two position detection marks passes through the rotational center of the susceptor and a center of the substrate receiving portion; and determining whether the substrate receiving portion is positioned in a predetermined range in accordance with the detected first two and second two position detection marks.
Public/Granted literature
Information query
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