Invention Grant
US08854517B2 Solid-state imaging device with stacked sensor and processing chips
有权
具有堆叠传感器和处理芯片的固态成像装置
- Patent Title: Solid-state imaging device with stacked sensor and processing chips
- Patent Title (中): 具有堆叠传感器和处理芯片的固态成像装置
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Application No.: US12725938Application Date: 2010-03-17
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Publication No.: US08854517B2Publication Date: 2014-10-07
- Inventor: Katsumi Honda , Takafumi Takatsuka
- Applicant: Katsumi Honda , Takafumi Takatsuka
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-072575 20090324; JP2009-153620 20090629
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N9/04 ; H04N5/376 ; H01L27/146 ; H04N5/374 ; H04N5/225

Abstract:
A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.
Public/Granted literature
- US20100245647A1 SOLID-STATE IMAGING DEVICE, DRIVING METHOD OF SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2010-09-30
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