ESD (electrostatic discharge) protection for radio frequency (RF) couplers included in the same semiconductor package as other integrated circuits, such as integrated circuits having power amplifier (PA) circuitry, is disclosed along with related systems and methods. The disclosed embodiments provide ESD protection for RF couplers within semiconductor packages by including coupler ESD circuitry within an integrated circuit within the semiconductor package and coupling the connection ports of the RF coupler to this coupler ESD circuitry. Further, this coupler ESD circuitry can be implemented using two sets of serially connected diodes so that the signal connected to the coupler ESD circuitry can swing around ground without being clipped by the ESD circuitry. Still further, the ESD diodes can be formed in deep N well structures to improve isolation and to reduce parasitic capacitance associated with the ESD diodes.