Invention Grant
- Patent Title: Integrated circuit
- Patent Title (中): 集成电路
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Application No.: US13591879Application Date: 2012-08-22
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Publication No.: US08854779B2Publication Date: 2014-10-07
- Inventor: Igsoo Kwon , Bokmoon Kang
- Applicant: Igsoo Kwon , Bokmoon Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Main IPC: H02H3/22
- IPC: H02H3/22
Abstract:
An integrated circuit includes an internal power line, a no-connection (NC) pad, and a switch configured to electrically connect the internal power line with the NC pad to supply a first external voltage to the internal power line through the NC pad in response to a control signal.
Public/Granted literature
- US20140055891A1 INTEGRATED CIRCUIT Public/Granted day:2014-02-27
Information query
