Invention Grant
- Patent Title: Buffer assembly and application method thereof
- Patent Title (中): 缓冲液组装及其应用方法
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Application No.: US13309569Application Date: 2011-12-02
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Publication No.: US08854803B2Publication Date: 2014-10-07
- Inventor: Qun Huang , Che-Yu Chou , Tai-Shan Zhu , Ji-Ping Wu
- Applicant: Qun Huang , Che-Yu Chou , Tai-Shan Zhu , Ji-Ping Wu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110051363 20110303
- Main IPC: B65D81/05
- IPC: B65D81/05 ; B65D85/48 ; G02F1/1333
Abstract:
A buffer assembly includes a buffer body and an adhesive layer on the buffer body. The buffer body includes a buffer portion and a mounting portion surrounding the buffer portion. The adhesive layer includes a first adhesive portion and a second adhesive portion surrounding the first adhesive portion. The first adhesive portion and the second adhesive portion respectively correspond to the buffer portion and the mounting portion. A first cutting line is disposed between the buffer portion and the mounting portion such that the mounting portion is separable from the buffer portion along the first cutting line. A second cutting line is disposed between the first adhesive portion and the second adhesive portion such that the second adhesive portion is separable from the first adhesive portion along the second cutting line. The second cutting line superposes the first cutting line.
Public/Granted literature
- US20120222807A1 BUFFER ASSEMBLY AND APPLICATION METHOD THEREOF Public/Granted day:2012-09-06
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