Invention Grant
- Patent Title: Modular data center
- Patent Title (中): 模块化数据中心
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Application No.: US13387092Application Date: 2010-03-22
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Publication No.: US08854809B2Publication Date: 2014-10-07
- Inventor: Matthew Daniel Neumann , Timothy Michael Rau
- Applicant: Matthew Daniel Neumann , Timothy Michael Rau
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2010/028174 WO 20100322
- International Announcement: WO2011/119143 WO 20110929
- Main IPC: H05K7/20
- IPC: H05K7/20 ; E04H1/00 ; E04H3/00 ; E04H5/00 ; E04H6/00 ; E04H9/00 ; E04H14/00 ; F25B45/00 ; G05D23/00 ; G06F1/20 ; H05K5/00 ; H05K7/14 ; H05K5/02
Abstract:
A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.
Public/Granted literature
- US20130044426A1 MODULAR DATA CENTER Public/Granted day:2013-02-21
Information query
