Invention Grant
- Patent Title: Hybrid cooling design for modular systems
- Patent Title (中): 模块化系统的混合冷却设计
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Application No.: US13169941Application Date: 2011-06-27
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Publication No.: US08854814B2Publication Date: 2014-10-07
- Inventor: Jinshui Liu , Tian Yu
- Applicant: Jinshui Liu , Tian Yu
- Applicant Address: US TX Plano
- Assignee: FutureWei Technologies, Inc.
- Current Assignee: FutureWei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; F28D15/00
Abstract:
A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.
Public/Granted literature
- US20120327597A1 Hybrid Cooling Design for Modular Systems Public/Granted day:2012-12-27
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