Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US13137867Application Date: 2011-09-20
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Publication No.: US08854826B2Publication Date: 2014-10-07
- Inventor: Tetsuya Ohsawa
- Applicant: Tetsuya Ohsawa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2010-227592 20101007; JP2011-155499 20110714
- Main IPC: H05K1/00
- IPC: H05K1/00 ; G11B5/48

Abstract:
A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.
Public/Granted literature
- US20120087041A1 Suspension board with circuit Public/Granted day:2012-04-12
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