Invention Grant
US08854907B2 Semiconductor device for supplying and measuring electric current through a pad
有权
用于通过焊盘供应和测量电流的半导体器件
- Patent Title: Semiconductor device for supplying and measuring electric current through a pad
- Patent Title (中): 用于通过焊盘供应和测量电流的半导体器件
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Application No.: US13590648Application Date: 2012-08-21
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Publication No.: US08854907B2Publication Date: 2014-10-07
- Inventor: Sang Kug Lym , Dong Keun Kim
- Applicant: Sang Kug Lym , Dong Keun Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0058230 20120531
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
The present invention relates to a semiconductor device, and more particularly, to a semiconductor memory device capable of supplying and measuring an electric current through a pad. The semiconductor device includes a memory cell, a data pad configured to receive data to be programmed into the memory cell or a write current to be supplied to the memory cell from an external device, and output data read out from the memory cell or a cell current flowing from the memory cell to the external device, and a path switching unit configured to set up a path so that the memory cell and the data pad are directly coupled when a test operation is performed.
Public/Granted literature
- US20130322164A1 SEMICONDUCTOR DEVICE FOR SUPPLYING AND MEASURING ELECTRIC CURRENT THROUGH A PAD Public/Granted day:2013-12-05
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