A camera module comprises an housing and at least two metal plating layers. The housing comprises a base and two platforms. The base includes a bottom surface, a top surface and an outer wall surface. A receiving hole configured to receive a lens device may be formed in the base, the receiving hole may pass through the base in a direction from the top surface to the bottom surface. The two platforms may be positioned above the top surface of the base and may have different heights. The metal plating layers extends on the outer wall surface of the base. A first end portion of each of the two metal plating layers extends to the top surface of the corresponding platform and the other end portion of the each metal plating layer extends to the bottom surface of the base.