Invention Grant
US08855949B2 Plasma processing device and method of monitoring discharge state in plasma processing device 有权
等离子体处理装置和等离子体处理装置中的放电状态监视方法

  • Patent Title: Plasma processing device and method of monitoring discharge state in plasma processing device
  • Patent Title (中): 等离子体处理装置和等离子体处理装置中的放电状态监视方法
  • Application No.: US13001810
    Application Date: 2009-06-29
  • Publication No.: US08855949B2
    Publication Date: 2014-10-07
  • Inventor: Masaru Nonomura
  • Applicant: Masaru Nonomura
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: Pearne & Gordon LLP
  • Priority: JPP2008-172974 20080702
  • International Application: PCT/JP2009/003000 WO 20090629
  • International Announcement: WO2010/001583 WO 20100107
  • Main IPC: G01R15/00
  • IPC: G01R15/00 H01J37/32
Plasma processing device and method of monitoring discharge state in plasma processing device
Abstract:
An object is to provide a plasma processing device capable of properly monitoring a state of plasma discharge and detecting a precursor to abnormal discharge, and a method of monitoring the state of discharge in the plasma processing device. In analysis processing for monitoring executed by detecting, by a signal analyzing portion 30, a signal of a potential change induced in a discharge detection sensor 23 in response to a change in plasma discharge of the inside of a processing chamber and recorded in a signal recorder 20, based on a counter value N3 obtained by detecting a signal of abnormal discharge (first arc discharge) generated between an electrode portion and an object to be processed by a first detector 33 and a counter value N4 obtained by detecting a signal of micro-arc discharge (second arc discharge) generated by deposition of a foreign substance in the processing chamber by a second detector 35, an abnormal discharge determining portion 39 calculates a difference (N3−N4) and compares the difference (N3−N4) with a threshold value a2 for determination and determines whether there is a possibility of generation of abnormal discharge in the processing chamber.
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