Invention Grant
- Patent Title: Integrated circuit design simulation matrix interpolation
- Patent Title (中): 集成电路设计仿真矩阵插值
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Application No.: US13251517Application Date: 2011-10-03
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Publication No.: US08855993B2Publication Date: 2014-10-07
- Inventor: Peter A. Habitz , Amol A. Joshi
- Applicant: Peter A. Habitz , Amol A. Joshi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and systems perform a simulation on an integrated circuit design by applying a first value to a first variable and a second value to a second variable of the simulation to produce a first matrix corner simulation value. The methods and systems repeat the simulation using different values for the first and said second variables to produce a second matrix corner simulation value, a third matrix corner simulation value, and a fourth matrix corner simulation value. The methods and systems create a matrix, and the matrix has the first matrix corner simulation value, the second matrix corner simulation value, the third matrix corner simulation value, and the fourth matrix corner simulation value. The methods and systems interpolate all remaining values within the matrix based upon existing simulation values within the matrix.
Public/Granted literature
- US20130085726A1 INTEGRATED CIRCUIT DESIGN SIMULATION MATRIX INTERPOLATION Public/Granted day:2013-04-04
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